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MS-98M3
MS-98M3
MS-98M3
MS-98M3
MS-98M3
MS-98M3

3.5" SBC with Intel® Tiger Lake-UP3 for Fanless, Ultra Low-Power, High-Performance & Wide Temperature Solution

  • Intel® 11th Gen Tiger Lake-UP3 Embedded/Industrial SKU Series
  • DDR4 3200 MHz SODIMM Slot up to 64GB
  • Quadruple independent displays: DP++ , HDMI™, 2 LVDS/eDP
  • 2 2.5GbE LAN with RJ-45
  • 1 M.2 B key (with NANO SIM-holder), 1 M.2 E key
  • 1 M.2 M key, 1 SATA 3.0 for storage
  • SATA RAID 0/1 (Supported by i7/i5 SKUs)
  • 4 USB 3.2 Gen 2, 4 USB 2.0, 4 COM (4 RS-485), DIO, Audio
  • Onboard TPM 2.0
  • Wide Voltage DC-IN 12~24V (OCP & OVP)
  • Wide operating temperature supported
  • 產品規格
  • Ordering-Information
  • Packing-List
  • Optional-Items

產品規格

  • 料號編碼
  • Embedded SKUs
  • Industrial SKUs

Processor

  • CPU
  • 11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i7-1185G7E/i5-1145G7E, QC, 28W
    11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i3-1115G4E, DC, 28W
    11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Celeron® 6305E, DC, 15W
  • 11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i7-1185GRE/i5-1145GRE, QC, 28W
    11th Gen Intel® IoTG Mobile Tiger Lake-UP3 Core™ i3-1115GRE, DC, 28W
  • Frequency
  • 1.5GHz~4.4GHz (Depends on CPU)
  • 1.5GHz~4.4GHz (Depends on CPU)
  • L2 Cache
  • 4MB~12MB (Depends on CPU)
  • 6MB~12MB (Depends on CPU)
  • CPU Type
  • BGA
  • BGA
  • BIOS
  • AMI
  • AMI

Memory

  • Technology
  • Dual-channel DDR4 3200MHz
  • Dual-channel DDR4 3200MHz
  • Max. Capacity
  • Up to 64GB
  • Up to 64GB
  • Socket
  • 2 x 260-pin SO-DIMMs
  • 2 x 260-pin SO-DIMMs

Display

  • Controller
  • Intel® Iris® Xe Graphics (For i7/i5 SKUs)
    Intel® UHD Graphics (For i3/Celeron SKUs)
  • Intel® Iris® Xe Graphics (For i7/i5 SKUs)
    Intel® UHD Graphics (For i3 SKU)
  • Graphic Memory
  • Depends on CPU
  • Depends on CPU
  • LVDS
  • 2 x Dual Channel 18/24-bit (Connector shared with eDP)
  • 2 x Dual Channel 18/24-bit (Connector shared with eDP)
  • eDP
  • 2 x eDP (Connector shared with LVDS)
  • 2 x eDP (Connector shared with LVDS)
  • HDMI
  • 1
  • 1
  • DisplayPort
  • 1
  • 1
  • Multiple Display
  • 4 independent displays
  • 4 independent displays
  • Display Interface
  • LVDS up to 1920 x 1200 @60 Hz
    eDP up to 4096 x 2160 @60 Hz
    HDMI™ up to 4096 x 2160 @30Hz
    DP up to 7680 x 4320 @60Hz
  • LVDS up to 1920 x 1200 @60 Hz
    eDP up to 4096 x 2160 @60 Hz
    HDMI™ up to 4096 x 2160 @30Hz
    DP up to 7680 x 4320 @60Hz

Ethernet

  • Controller
  • 2 x Intel® I225-LM 2.5 GbE LAN
  • 2 x Intel® I225-IT 2.5 GbE LAN
    (LAN Speed running at 1000/100/10Mbps when OP TEMP. over 70°C)

Audio

  • Controller
  • Realtek® ALC888-VD2-GR HD Audio Codec
  • Realtek® ALC888-VD2-GR HD Audio Codec

Super I/O

  • Controller
  • Fintek F81966AB-I
  • Fintek F81966AB-I

H/W Monitor

  • Watchdog Timer
  • 256-level Watchdog Timer
  • 256-level Watchdog Timer
  • Smart Fan
  • Yes
  • Yes

TPM

  • Controller
  • Infineon SLB9670VQ2.0
  • Infineon SLB9670XQ2.0

Expansion Slot

  • M.2
  • 1 x M.2 M key (PCIe Gen4 x4 NVMe), 2280
    1 x M.2 B key (SATA 3.0, PCIe x1, USB 2.0, w/NANO SIM-Holder), 2242/3042
    1 x M.2 E key (PCIe x1, USB 2.0), 2230
  • 1 x M.2 M key (PCIe Gen4 x4 NVMe), 2280
    1 x M.2 B key (SATA 3.0, PCIe x1, USB 2.0, w/NANO SIM-Holder), 2242/3042
    1 x M.2 E key (PCIe x1, USB 2.0), 2230

Storage

  • SATA
  • 1 x SATA 3.0
  • 1 x SATA 3.0

I/O Interface

  • USB
  • 4 x USB 2.0 (internal)
    4 x USB 3.2 Gen 2 (rear)
  • 4 x USB 2.0 (internal)
    4 x USB 3.2 Gen 2 (rear)
  • Serial
  • 4 x COM ports (internal)
    COM1~4: RS-232/422/485, 0V/5V/12V, support auto flow control
  • 4 x COM ports (internal)
    COM1~4: RS-232/422/485, 0V/5V/12V, support auto flow control
  • GPIO
  • 16-bits (8 x GPI; 8 x GPO), 5V
  • 16-bits (8 x GPI; 8 x GPO), 5V

Power Supply

  • DC Input
  • DC-in 12~24V (OCP & OVP)
  • DC-in 12~24V (OCP & OVP)

Environment

  • Operating Temperature
  • -10 ~ 60°C
    Note:
    1. Thermal w/ Airflow:0.7m/s
    2. The standard thermal solution only supports TDP up to 15W.
  • -40 ~ 70°C (w/Turbo disabled)
    Note:
    1. Thermal w/ Airflow:0.7m/s
    2. The standard thermal solution only supports TDP up to 15W.
    3. -40 ~ 85°C by request
  • Operating Humidity
  • 10 ~ 90%, non-condensing
  • 10 ~ 90%, non-condensing
  • Storage Humidity
  • 10 ~ 90%, non-condensing
  • 10 ~ 90%, non-condensing
  • Storage Temperature
  • -20 ~ 80°C
  • -40 ~ 85°C

Form Factor

  • Dimensions
  • 146 x 102 mm (3.5")
  • 146 x 102 mm (3.5")
  • Weight
  • 0.65 kg
  • 0.65 kg

Certification

  • EMC
  • FCC, CE, RCM, VCCI, BSMI, UKCA, IC
  • FCC, CE, RCM, VCCI, BSMI, UKCA, IC

Software Platform

  • OS Support
  • Windows 10 IoT Enterprise 2019 LTSC (64-bit, RS5)
    Windows 10 IoT Enterprise 2021 LTSC (64-bit, 21H2)
    Linux (Support by request)
  • Windows 10 IoT Enterprise 2019 LTSC (64-bit, RS5)
    Windows 10 IoT Enterprise 2021 LTSC (64-bit, 21H2)
    Linux (Support by request)

Ordering Information

  • Part Number
  • Description
  • 919-98M3-001
  • MS-98M3\609-98M3-010\809-98M3-014 VER 1.0 STD Intel Tiger Lake-UP3, i7-1185GRE,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,WT
  • 919-98M3-002
  • MS-98M3\609-98M3-020\809-98M3-015 VER 1.0 OPT:A Intel Tiger Lake-UP3,i5-1145GRE,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,WT
  • 919-98M3-003
  • MS-98M3\609-98M3-030\809-98M3-016 VER 1.0 OPT:B Intel Tiger Lake-UP3, i3-1115GRE,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,WT
  • 919-98M3-004
  • MS-98M3\609-98M3-040\809-98M3-017 VER 1.0 OPT:C Intel Tiger Lake-UP3, i7-1185G7E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT
  • 919-98M3-005
  • MS-98M3\609-98M3-050\809-98M3-018 VER 1.0 OPT:D Intel Tiger Lake-UP3, i5-1145G7E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT
  • 919-98M3-006
  • MS-98M3\609-98M3-060\809-98M3-019 VER 1.0 OPT:E Intel Tiger Lake-UP3, i3-1115G4E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT
  • 919-98M3-007
  • MS-98M3\609-98M3-070\809-98M3-020 VER 1.0 OPT:F Intel Tiger Lake-UP3, Celeron 6305E,2*DDR4,1*DP,1*HDMI™,2*LVDS/eDP,3*M.2,2*2.5GbE LAN,1*SATA3.0,4*USB3.2 Gen2,4*USB 2.0,4*COM,DC 12~24V,Non-WT

Packing List

  • Part Number
  • Description
  • Quantity
  • K1G-3002057-V03
  • DC Power Cable, 200mm
  • 1
  • K14-3018001-V03
  • COM Port Cable, 150mm
  • 1
  • K1B-3008067-V03
  • USB Cable, 150mm
  • 1
  • K1D-3012023-V03
  • SATA Cable with Power, 230mm
  • 1

Optional Item

  • Part Number
  • Description
  • E31-0806800-K08
  • Heatspreader
The MSI MS-98M9 ATX industrial motherboard supports 1st and 2nd Gen Intel® Cascade Lake/Skylake Xeon® Scalable Processors with Intel® C622/C621 chipset. It features six DDR4 2666 MHz ECC RDIMM slots for up to 192GB, dual 10GbE LAN and dual GbE LAN ports, multiple PCIe slots, mSATA, and eight SATA 3.0 ports with RAID support. It includes extensive I/O options, onboard TPM 2.0, and supports Intel® VROC for RAID with NVMe storage. The motherboard is designed for high-performance industrial applications. For more details, you can visit the [MSI product page](https://ipc.msi.com/product_detail/Industrial-Motherboard/ATX/MS-98m9).
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