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AI software applications EdgeXpert + Hermes AI Agent MS-C936 MS-C910E MS-C927 MS-CF20 V2.0 & MS-CF20 MS-CF16 V3.0 & MS-CF16

Latest Products

EdgeXpert

EdgeXpert

AI Supercomputer Based on NVIDIA® DGX Spark™ GB10 Platform NVIDIA® Grace Blackwell (GB10) Architecture: - NVIDIA Blackwell GPU & Arm 20-core CPU - NVIDIA® NVLink®-C2C CPU-GPU memory interconnect 128 GB LPDDR5x coherent, unified system memory 1000 AI TOPS (FP4) AI performance Full stack solution, hardware & software, designed for AI developers ConnectX-7 networking: Scales out from 2 to 4 EdgeXpert systems, expanding total VRAM up to 256 GB/384 GB/512 GB - 3-node cluster: ring topology via 3 QSFP DAC cables (switchless) - 4-node cluster: star topology via a 200 GbE QSFP Ethernet switch

MS-C936

MS-C936

Slim Fanless Box PC with Intel® Raptor Lake-P Refresh Platform U-Series, High Performance & Low-Power for 4K2K Digital Signage, KIOSK, Automation & AIoT Edge Computer Intel® Raptor Lake-P Refresh U-series 2 DDR5 5200 MHz SODIMM slots up to 96GB Quadruple independent displays: 2 HDMI, 2 DP 2 2.5GbE LAN with RJ-45 1 M.2 B key (with NANO SIM-holder), 1 M.2 E key 1 M.2 M key, 1 SATA 3.0 (2.5” SSD, 7mm) for storage AHCI, SATA RAID 0/1 (SATA ports and M.2 M Key [SATA mode]) 4 USB 3.2 Gen 2, 6 USB 2.0, 2 COM, Line-out Onboard TPM 2.0 Easy access all on bottom side for 2 Memory, 3 M.2, 2.5”SSD Cableless design with proprietary board DC-IN 12V/19V Slim & fanless design with thinness 29mm Anti-Vibration & Shockproof Design to Compliance IEC 60068-2

Comprehensive IPC Integrated Solutions

We design & manufacture high-quality embedded boards and systems for various applications. Additionally, we provide efficient DMS (Design, Manufacturing, and Service) solutions for our customers and aspire to become the best partner for global embedded and industrial market partners.

Design & Manufacturing Services

We are a seasoned, cutting-edge department specializing in industrial/embedded motherboards and BOX IPC barebone/systems for discerning OEMs. With a wealth of experience, we offer both standard products and tailored design solutions.

Our custom design process is meticulously structured and validated. We prioritize seamless customer interaction, ensuring accessibility with reasonable NRE costs and flexible project size parameters. In each ODM engagement, our objective extends beyond meeting specifications; we aim to streamline design timelines, minimize costs, and mitigate risks.

Explore further below to discover how we can become the ideal ODM partner you've been seeking.

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News & Events

Coming Trade Shows

View All Trade Shows
China International Industry Fair 2026

China International Industry Fair 2026

  • Date: 2026-10-12 ~ 2026-10-16
  • Location: NECC Shanghai, China
  • Booth_no. Hall 6.1 Booth B011
Embedded World 2027

Embedded World 2027

  • Date: 2027-03-16 ~ 2027-03-18
  • Location: Nuremberg, Germany
  • Booth_no. Hall 3-540
Japan IT Week Spring 2027

Japan IT Week Spring 2027

  • Date: 2027-04-07 ~ 2027-04-09
  • Location: Tokyo Big Sight, Japan
  • Booth_no. East Hall 5 #E52-5

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